Engineering and Technical Support Group
School of Information Technology & Electrical Engineering

OH&S Requirements

  1. Ensure you have either completed a Risk Assessment or read (and confirmed as being read) the relevant Risk Assessment before attempting to operate this equipment
  2. The Process ID which refers to the general Risk Assessment regarding activities in the Darkroom / PCB Etching Facility is 19251 and addresses the operation of the Bungard Laminator
  3. The UQ Risk Management Database is located at: https://www.risk.admin.uq.edu.au/Signin.aspx
  4. Visually check the equipment is safe to operate and the electrical safety tag is current.  If expired, the equipment must be tested and tagged before proceeding.
  5. Wear safety glasses, gloves and a lab coat before you begin
  6. Clean room protocols apply to the Darkroom / PCB Etching Facility

Minimum PCB Thickness

Is the PCB less than 0.4mm thick:

  • YES = It is not possible to laminate the material with a thickness less than 0.4mm (you may increase the thickness of the material by laminating 2 PCB's at once or by using a sacrificial piece of PCB material)
  • NO = Go to next section

Lamination Material

Is the Tenting Photoresist Laminate 50-02-01 mounted and the quantity sufficient to complete the task:

  • YES = Go to next section
  • NO = Mount the Tenting Photoresist Laminate 50-02-01 in accordance with the instructions on Page 4 of Bungard Manual K146A.MN1 ensuring there is sufficient quantity to complete the task

Lamination Alignment

Are the upper and lower laminates exactly superimposed:

  • YES = Go to next section
  • NO = Adjust in accordance with the instructions on Page 4 of Bungard Manual K146A.MN1

Configure Device

  1. Se the MAINS switch to ON
  2. Turn the heaters on and set the temperature in accordance with the configuration table.  Instructions for setting the temperature may be found on Page 03 of the Bungard Manual K146A.MN1
  3. Allow 40 minutes for the temperature to stabilise before continuing
  4. Set the speed control in accordance with the configuration table
  5. Set the roller pressure setting in accordance with the configuration table

Configuration Table

PCB Thickness TEMPoC SPEED SETTING m/min PRESSURE SETTING
0.50mm 105oC 0.5m/min 2
1.60mm 105oC 0.5m/min 2

Lamination Process

  1. Thoroughly clean the PCB material before continuing
  2. Set the RUN switch to ON
  3. Let the cardboard sheet exit the lamination rollers - it is assumed that at the end of each job a piece of cardboard has been left between the lamination rollers
  4. Insert the PCB to be laminated through the brushes of the inlet table and push it lightly until taken up by the lamination rollers - allow approx 2cm between PCB's if laminating mulitple boards!
  5. Once the final PCB has been inserted allow approx 2cm before inserting a cardboard sheet
  6. With the end of the cardboard sheet still between the lamination rollers set the RUN switch to OFF

Shutdown

  1. Ensure the lamination pressure is returned to zero upon completion of the task
  2. Ensure a sheet of cardboard has been left between the lamination rollers at the end of each task to keep the rollers clean and prevent damage
  3. If required, clean the rollers once they have cooled down, never leave the machine with dirty or contaminated rollers

Additional Information

The manufacturers safety data sheet for the Tenting Photoresist Laminate 50-02-01 is pending

Amendments to Procedure

Inform the Engineering & Technical Support Manager at the earliest opportunity if this procedure has, or needs to be altered in any way