OH&S Requirements
- Ensure you have either completed a Risk Assessment or read (and confirmed as being read) the relevant Risk Assessment before attempting this procedure
- No Risk Assessment has be sighted as of 13/05/2012
- The UQ Risk Management Database is located at: www.risk.admin.uq.edu.au
- Visually check any equipment is safe to operate and the electrical safety tag is current. If expired, the equipment must be tested and tagged before proceeding
- Wear safety glasses, gloves and a lab coat before you begin
- Clean room protocols apply to the Darkroom / PCB Etching Facility
Application
- Apply Chipbonder EEL 97-10-02 using an appropriate needle
- Place drops in such a way that the adhesive is completely covered by the component
Curing
- Cure the assembly for 5 minutes at 150 deg C or 10 minutes at 130 deg C
- The product will not cure below 120 Deg C
- In cases where the adhesive drop is exposed e.g. S023 components, cure should be at 150 deg.
- Irradiation of assembly with UV light prior to curing will gel the exposed adhesive and allow to cure at 130 deg C
Additional Information
- The manufacturer's safety data sheet for Chipbonder 3608 EEL 97-10-02 is MSDS002
Amendments to Procedure
Inform the Engineering & Technical Support Manager at the earliest opportunity if this procedure has, or needs to be altered in any way