OH&S Requirements
- Ensure you have either completed a Risk Assessment or read (and confirmed as being read) the relevant Risk Assessment before attempting to operate this equipment
- The Process ID which refers to the general Risk Assessment regarding activities in the Darkroom / PCB Etching Facility is 19251 and addresses the operation of the Bungard Laminator
- The UQ Risk Management Database is located at: https://www.risk.admin.uq.edu.au/Signin.aspx
- Visually check the equipment is safe to operate and the electrical safety tag is current. If expired, the equipment must be tested and tagged before proceeding.
- Wear safety glasses, gloves and a lab coat before you begin
- Clean room protocols apply to the Darkroom / PCB Etching Facility
Minimum PCB Thickness
Is the PCB less than 0.4mm thick:
- YES = It is not possible to laminate the material with a thickness less than 0.4mm (you may increase the thickness of the material by laminating 2 PCB's at once or by using a sacrificial piece of PCB material)
- NO = Go to next section
Lamination Material
Is the Tenting Photoresist Laminate 50-02-01 mounted and the quantity sufficient to complete the task:
- YES = Go to next section
- NO = Mount the Tenting Photoresist Laminate 50-02-01 in accordance with the instructions on Page 4 of Bungard Manual K146A.MN1 ensuring there is sufficient quantity to complete the task
Lamination Alignment
Are the upper and lower laminates exactly superimposed:
- YES = Go to next section
- NO = Adjust in accordance with the instructions on Page 4 of Bungard Manual K146A.MN1
Configure Device
- Se the MAINS switch to ON
- Turn the heaters on and set the temperature in accordance with the configuration table. Instructions for setting the temperature may be found on Page 03 of the Bungard Manual K146A.MN1
- Allow 40 minutes for the temperature to stabilise before continuing
- Set the speed control in accordance with the configuration table
- Set the roller pressure setting in accordance with the configuration table
Configuration Table
PCB Thickness |
TEMPoC |
SPEED SETTING m/min |
PRESSURE SETTING |
0.50mm |
105oC |
0.5m/min |
2 |
1.60mm |
105oC |
0.5m/min |
2 |
Lamination Process
- Thoroughly clean the PCB material before continuing
- Set the RUN switch to ON
- Let the cardboard sheet exit the lamination rollers - it is assumed that at the end of each job a piece of cardboard has been left between the lamination rollers
- Insert the PCB to be laminated through the brushes of the inlet table and push it lightly until taken up by the lamination rollers - allow approx 2cm between PCB's if laminating mulitple boards!
- Once the final PCB has been inserted allow approx 2cm before inserting a cardboard sheet
- With the end of the cardboard sheet still between the lamination rollers set the RUN switch to OFF
Shutdown
- Ensure the lamination pressure is returned to zero upon completion of the task
- Ensure a sheet of cardboard has been left between the lamination rollers at the end of each task to keep the rollers clean and prevent damage
- If required, clean the rollers once they have cooled down, never leave the machine with dirty or contaminated rollers
Additional Information
The manufacturers safety data sheet for the Tenting Photoresist Laminate 50-02-01 is pending
Amendments to Procedure
Inform the Engineering & Technical Support Manager at the earliest opportunity if this procedure has, or needs to be altered in any way